AI Daily Briefing
- Huawei’s Post-Moore Plan: 1.4nm Chips Via Smarts, Not Just Shrinks: Forget brute-force shrinking. Huawei is betting on clever design and interconnects to push chip performance well beyond traditional Moore’s Law limits. Their new roadmap targets 1.4nm-equivalent gains by rethinking the entire system.
- Chiplets Now Under the Crosshairs: New Attack Vectors Emerge: The future of computing is modular, but a new paper out of France reveals that this innovation comes with a hidden cost: an entirely new class of side-channel attacks.
- Japan GPU Prices Crash: RX 9070 XT & RX 9060 XT Below MSRP: Forget the global RAMpocalypse; Japan is seeing AMD’s latest RDNA 4 GPUs cratering below MSRP. The RX 9070 XT and RX 9060 XT are the latest victims of a market apparently unimpressed, or perhaps just swimming in excess inventory.
- AI: Does It Finally Fix Chip Characterization’s Messy Past?: Chip design’s tedious library characterization phase just got an AI facelift. Siemens is betting its new Solido suite can slay the multi-week simulation dragon, but at what cost?
- M6 MacBook Pro: Vapor Chamber Cooling Rumored: Whispers from the supply chain suggest Apple’s upcoming M6 MacBook Pro could ditch its long-suffering single heatpipe for a sophisticated vapor chamber cooling system. This could finally unlock sustained performance.
- Samsung’s P4 HBM Shift: 2027 DRAM Crunch Looms: The memory market’s delicate balance is at risk. Samsung’s bold move to prioritize next-gen HBM could leave the world scrambling for standard DRAM.
- Daily Briefing: May 25, 2026: Your AI morning briefing for May 25, 2026 — the top stories you need to know.
- Intel’s Nova Lake: E-Cores Only for Edge?: Intel’s Nova Lake is shaping up to be a versatile beast, but their latest reported move for the edge segment raises an eyebrow. They’re apparently ditching performance cores entirely for an all-E-core design.
